DANSK DSF/PREN IEC 60749-20 PDF

Name:
DANSK DSF/PREN IEC 60749-20 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

DRAFT * W/D S/S BY DS/EN IEC 60749-20

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Edition :	19
File Size :	1 file , 1.3 MB
Number of Pages :	30
Product Code(s) :	DSF-021, DSF-021

History

DANSK DSF/PREN IEC 60749-20

Published Date:

Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

$12

DANSK DS/EN IEC 60749-20

Published Date: 10/12/2020

Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

$23.4

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