DANSK DSF/PREN IEC 60749-34-1 PDF

This part of IEC IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the power dissipation of the internal semiconductors and the internal connectors. It is based on IEC 60749 -34, Power cycling, but is developed specifically for silicon-based power semiconductor module products. This test causes wear-out and is considered destructive.