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DANSK DSF/PREN IEC 60749-39 PDF

DANSK DSF/PREN IEC 60749-39 PDF

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DANSK DSF/PREN IEC 60749-39 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$8.7
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DRAFT * W/D S/S BY DS/EN IEC 60749-39

This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. NOTE – It is recommended that the moisture absorption parameters used in this standard be obtained from the material suppliers (such as the resin supplier).


Edition : 20
File Size : 1 file , 1 MB
Number of Pages : 14
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/PREN IEC 60749-39
DANSK DSF/PREN IEC 60749-39
Published Date:
Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
$8.7
DANSK DS/EN IEC 60749-39
DANSK DS/EN IEC 60749-39
Published Date: 01/24/2022
Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
$18

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