DANSK DSF/PREN IEC 61188-6-2 PDF

Name:
DANSK DSF/PREN IEC 61188-6-2 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

DRAFT * W/D S/S BY DS/EN IEC 61188-6-2

This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This part includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of the IEC 61191 series.

Edition :	20
File Size :	1 file , 1.3 MB
Number of Pages :	27
Product Code(s) :	DSF-021, DSF-021

History

DANSK DSF/PREN IEC 61188-6-2

Published Date:

Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

$12

DANSK DS/EN IEC 61188-6-2

Published Date: 03/16/2021

Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

$22.5

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