DANSK DSF/PREN IEC 61188-6-3 PDF

Name:
DANSK DSF/PREN IEC 61188-6-3 PDF

Published Date:

Status:
[ Draft ]

Description:

Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

DRAFT

This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1, and IEC 61191-3.

Edition :	23#
File Size :	1 file , 1.9 MB
Number of Pages :	31
Product Code(s) :	DSF-021, DSF-021

History

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