Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

DRAFT * W/D S/S BY DS/EN IEC 61189-2-801

This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

Edition :	21
File Size :	1 file , 930 KB
Number of Pages :	12
Product Code(s) :	DSF-009, DSF-009

DANSK DSF/PREN IEC 61189-2-801 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials

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