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DANSK DSF/PREN IEC 61189-2-808 PDF

DANSK DSF/PREN IEC 61189-2-808 PDF

Name:
DANSK DSF/PREN IEC 61189-2-808 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$8.7
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DRAFT

This document describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. It is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. Note: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.


Edition : 23#
File Size : 1 file , 1.6 MB
Number of Pages : 20
Product Code(s) : DSF-009, DSF-009

History

DANSK DS/EN IEC 61189-2-808
DANSK DS/EN IEC 61189-2-808
Published Date: 06/06/2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method
$19.2
DANSK DSF/PREN IEC 61189-2-808
DANSK DSF/PREN IEC 61189-2-808
Published Date:
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method
$8.7

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