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DANSK DSF/PREN IEC 61189-5-301 PDF

DANSK DSF/PREN IEC 61189-5-301 PDF

Name:
DANSK DSF/PREN IEC 61189-5-301 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: Test methods for printed board assemblies – Soldering paste using fine solder particles

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$12
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DRAFT * W/D S/S BY DS/EN IEC 61189-5-301

This International Standard specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This International Standard is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which may affect the test result by existing test methods.


Edition : 20
File Size : 1 file , 2.2 MB
Number of Pages : 35
Product Code(s) : DSF-021, DSF-021

History

DANSK DSF/PREN IEC 61189-5-301
DANSK DSF/PREN IEC 61189-5-301
Published Date:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: Test methods for printed board assemblies – Soldering paste using fine solder particles
$12
DANSK DS/EN IEC 61189-5-301
DANSK DS/EN IEC 61189-5-301
Published Date: 05/04/2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: General test methods for materials and assemblies – Soldering paste using fine solder particles
$27

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