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DANSK DSF/PREN IEC 61189-5-501 PDF

DANSK DSF/PREN IEC 61189-5-501 PDF

Name:
DANSK DSF/PREN IEC 61189-5-501 PDF

Published Date:

Status:
[ Draft ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$12
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DRAFT

This part of IEC 61189-5 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupon shall be used for the evaluation. Coupons shall be conditioned and measurements taken at a high temperature and humidity. The electrodes are electrically biased during conditioning to facilitate electrochemical reactions, see Figure 1 and Figure 3. Reference should be made to IEC TR 61189-5-506 that examined different geometry comb patterns: 400❍m x 500❍m; 400❍m x 200❍m; and 318❍m x 318❍m.


Edition : 20
File Size : 1 file , 1.2 MB
Number of Pages : 21
Product Code(s) : DSF-021, DSF-021

History

DANSK DSF/PREN IEC 61189-5-501
DANSK DSF/PREN IEC 61189-5-501
Published Date:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes
$12
DANSK DS/EN IEC 61189-5-501
DANSK DS/EN IEC 61189-5-501
Published Date: 03/09/2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes
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