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DANSK DSF/PREN IEC 61249-2-51 PDF

DANSK DSF/PREN IEC 61249-2-51 PDF

Name:
DANSK DSF/PREN IEC 61249-2-51 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated Circuit card carrier tape, unclad

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$8.7
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DRAFT * W/D NO S/S

This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape, unclad(hereinafter referred to as IC carrier tape base materials). This standard is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.


Edition : 22#
File Size : 1 file , 1.1 MB
Number of Pages : 17
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/FPREN IEC 61249-2-51
DANSK DSF/FPREN IEC 61249-2-51
Published Date:
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated circuit card carrier tape, unclad
$8.7
DANSK DSF/PREN IEC 61249-2-51
DANSK DSF/PREN IEC 61249-2-51
Published Date:
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated Circuit card carrier tape, unclad
$8.7
DANSK DS/EN IEC 61249-2-51
DANSK DS/EN IEC 61249-2-51
Published Date: 06/19/2023
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for integrated circuit card carrier tape, unclad
$19.2

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