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DANSK DSF/PREN IEC 62148-21 PDF

DANSK DSF/PREN IEC 62148-21 PDF

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DANSK DSF/PREN IEC 62148-21 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Publisher:
Dansk Standard

Document status:
Active
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Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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DRAFT * W/D S/S BY DS/EN IEC 62148-21

This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.


Edition : 20
File Size : 1 file , 1.3 MB
Number of Pages : 15
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/PREN IEC 62148-21
DANSK DSF/PREN IEC 62148-21
Published Date:
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$8.7
DANSK DSF/FPREN IEC 62148-21
DANSK DSF/FPREN IEC 62148-21
Published Date:
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch Ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$8.7
DANSK DS/EN IEC 62148-21
DANSK DS/EN IEC 62148-21
Published Date: 06/07/2021
Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$18
DANSK DS/EN IEC 62148-21
DANSK DS/EN IEC 62148-21
Published Date: 05/06/2019
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$18

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