DANSK DSF/PREN IEC 62878-2-603 PDF

DANSK DSF/PREN IEC 62878-2-603 PDF

Name:
DANSK DSF/PREN IEC 62878-2-603 PDF

Published Date:

Status:
[ Draft ]

Description:

Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

Publisher:
Dansk Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
dansk-dsf-pren-iec-62878-2-603_2717266

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8.70 €
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This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.


Edition : 23#
File Size : 1 file , 1.3 MB
Number of Pages : 14
Product Code(s) : DSF-009, DSF-009

History


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