DANSK DSF/PREN IEC 63215-5 PDF

This part of IEC 63215 specifies temperature cycling test method which is taking into account of actual usage conditions of module type power electronic devices to evaluate reliability of the die attach joint materials and joining system. This document applies to the die attach materials and joining system applied to module type power electronic devices. The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one to be used to guarantee the reliability of the power semiconductor device packages.