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DANSK DSF/PREN IEC 63378-3 PDF

DANSK DSF/PREN IEC 63378-3 PDF

Name:
DANSK DSF/PREN IEC 63378-3 PDF

Published Date:

Status:
[ Draft ]

Description:

Thermal standardization on semiconductor packages – Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$8.7
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DRAFT

This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.


Edition : 24#
File Size : 1 file , 1.5 MB
Number of Pages : 16
Product Code(s) : DSF-009, DSF-009

History

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