DIN 28400-3 - DRAFT PDF

Published Date: 06/01/2013

Vacuum technology - Terms and definitions - Part 3: Vacuum gauges

Published Date: 10/01/2011

Draft Document - Vacuum technology - terms and definitions - Part 3: Vacuum gauges

Published Date: 06/01/1992

Vacuum technology; terms and definitions; vacuum gauges

Published Date: 03/01/1999

Extensions for Financial Services (XFS) interface specification - Part 5: Cash Dispenser Device Class Interface; programmer's reference; English version CWA 13449-5:1998

Published Date: 02/01/2018

Maintenance - Maintenance terminology; Trilingual version EN 13306:2017

Published Date: 10/01/2005

Draft Document - International Electrotechnical Vocabulary - Part 471: Insulators (IEC 1/1956/CDV:2005)

Published Date: 04/01/2018

Primary packaging materials for medicinal products - Particular requirements for the application of ISO 9001:2015, with reference to good manufacturing practice (GMP) (ISO 15378:2017)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage