DIN 4000-190 - DRAFT PDF

DIN 4000-190 - DRAFT PDF

Name:
DIN 4000-190 - DRAFT PDF

Published Date:
10/01/2019

Status:
Active

Description:

Draft Document - Tabular layouts of properties - Part 190: Clamping devices

Publisher:
Deutsches Institut Fur Normung E.V. (German National Standard)

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$51.666
Need Help?

File Size : 1 file
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 76
Product Code(s) : 3085317, 3085317
Published : 10/01/2019

History


Related products

DIN 4000-126
Published Date: 09/01/2012
Tabular layouts of properties - Part 126: Reamers with non-indexable cutting edges
$26.814
DIN 4000-22
Published Date: 07/01/2008
Tabular layouts of properties - Part 22: Tools for sawing
$17.985
DIN 4000-167
Published Date: 10/01/2010
Tabular layouts of properties - Part 167: Measuring devices for geometrical quantities
$38.913
DIN 4000-141
Published Date: 04/01/2023
Tabular layouts of properties - Part 141: Hobs with bore or shank for cylindrical gears
$42.51

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1