DIN EN 140401 - DRAFT PDF

Published Date: 02/01/2002

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001

Published Date: 01/01/2003

Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests; Test 11e: Mould growth (IEC 60512-11-5:2002); German version EN 60512-11-5:2002

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003

Published Date: 03/01/2005

Filters using waveguide type dielectric resonators - Part 2: Guidance for use (IEC 61337-2:2004); German version EN 61337-2:2004

Published Date: 01/01/1991

Addendum 1 to ANSI/NCITS X3.100-1989, Interface Between DTE & DCE for Packet Mode Operation with Packet Switch Data Communications Networks - NUI and NUI-Derived Facility Extensions (formerly ANSI X3.100-1989(R1995) Add.1:1991)

Published Date: 01/01/1989

Interface Between DTE & DCE for Packet Mode Operation with Packet Switch Data Communications Networks (CCITT X.25) (formerly ANSI X3.100-1989(R1995)

Published Date: 01/01/1983

Unrecorded Magnetic Tape Minicassette For Information Interchange, Coplanar 3.81 mm (0.150 Inch) (formerly ANSI X3.103-1983(R1996))

Published Date: 01/01/1990

Specification for General Purpose Paper Cards for Information Interchange (formerly ANSI X3.11-1990(R2002))

Published Date: 01/01/1986

Matrix Character Sets for Optical Character Recognition (OCR-M) (formerly ANSI X3.111-1986(R1997))

Published Date: 01/01/1984

14-Inch (356 mm) Diameter Low Surface Friction Magnetic Storage Disk (formerly ANSI X3.112-1984(R1996))