DIN EN 2799 - DRAFT PDF

Published Date: 09/01/2018

Aerospace series - Fluorocarbon rubber (FKM) - Low compressions set - Hardness 90 IRHD; German and English version EN 2799:2018

Published Date: 10/01/2017

Draft Document - Aerospace series - Fluorocarbon rubber (FKM) - Low compressions set - hardness 90 IRHD; German and English version FprEN 2799:2017

Published Date: 08/01/1995

Draft Document - Aerospace series - Fluorocarbon rubber (FPM) - Low compression set, hardness 90 IRHD

Published Date: 05/01/1999

Draft Document - Aerospace series - Heat resisting alloy NI-CH1303 (NiCo20Cr20Mo5Ti2Al), vacuum melted, solution treated and precipitation treated - Precision casting, D<(Index)e> 50 mm

Published Date: 11/01/1996

Draft Document - Aerospace series - Instructions for the drafting and use of metallic material standards - Part 3: Specific requirements for heat resisting alloys; Inactive for new design

Published Date: 12/01/2001

Aerospace series - Nuts, hexagon, slotted/castellated, reduced height, normal across flats, in heat resisting steel, silver plated - Classification: 900 MPa (at ambient temperature)/650 °C; German version EN 2809:2001

Published Date: 03/01/2020

Aerospace series - Heat resisting alloy FE-PA2601 - Softened and cold worked - Bar for forged fasteners - D ≤ 50 mm - 1 100 MPa ≤ Rₘ ≤ 1 300 MPa; German and English version EN 3761:2020

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage