DIN EN 50483-3 PDF

DIN EN 50483-3 PDF

Name:
DIN EN 50483-3 PDF

Published Date:
11/01/2009

Status:
Active

Description:

Test requirements for low voltage aerial bundled cable accessories - Part 3: Tension and suspension clamps for neutral messenger system; German version EN 50483-3:2009

Publisher:
DIN-adopted European Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$27.468
Need Help?

Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 41
Product Code(s) : 1539969
Published : 11/01/2009

History


Related products

DIN 48170
Published Date: 08/01/1986
Roof poles for overhead power lines up to 1000 V; combination, components
$15.696
DIN EN 50326
Published Date: 01/01/2003
Conductors for overhead lines - Characteristics of greases; German version EN 50326:2002
$29.103
DIN EN 50341-2
Published Date: 11/01/2002
Overhead electrical lines exceeding AC 45 kV - Part 2: Index of National Normative Aspects; German version EN 50341-2:2001
$6.867
DIN EN 50483-6 - DRAFT
Published Date: 09/01/2008
Draft Document - Test requirements for low voltage aerial bundled cable accessories - Part 6: Environmental testing; German version FprEN 50483-6:2008
$9.81

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1