DIN EN 60191-4 PDF

Published Date: 02/01/2019

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018

Published Date: 10/01/2014

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014

Published Date: 03/01/2003

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002

Published Date: 06/01/1978

Semiconductor devices; metal cases with ceramic insulation, requirements and tests

Published Date: 06/01/2021

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020

Published Date: 11/01/2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007

Published Date: 07/01/2010

Draft Document - Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/906/CD:2010)

Published Date: 01/01/1974

Published Date: 02/01/1990