DIN EN 60191-6-4 PDF

Name:
DIN EN 60191-6-4 PDF

Published Date:
01/01/2004

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	20
Product Code(s) :	9524259, 9524259
Published :	01/01/2004

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