DIN EN 60352-8 PDF

Name:
DIN EN 60352-8 PDF

Published Date:
12/01/2011

Status:
Active

Description:

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011

Publisher:
DIN-adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	23
Product Code(s) :	1813694, 1813694
Published :	12/01/2011

History

Related products

DIN EN 60191-6-2

Published Date: 09/01/2002

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1.50 mm, 1.27 mm and 1.00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

$24.525

DIN IEC 62258-3 - DRAFT

Published Date: 06/01/2004

Draft Document - Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage (IEC 47/1750/CD:2004)

$44.472

DIN EN 61360-5

Published Date: 05/01/2005

Standard data element types with associated classification scheme for electric components - Part 5: Extensions to the EXPRESS dictionary schema (IEC 61360-5:2004); German version EN 61360-5:2004, text English

$44.472

DIN IEC 62047-9 - DRAFT

Published Date: 03/01/2008

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)

$31.392