DIN EN 60544-1 PDF

Published Date: 04/01/2014

Electrical insulating materials - Determination of the effects of ionizing radiation - Part 1: Radiation interaction and dosimetry (IEC 60544-1:2013); German version EN 60544-1:2013

Published Date: 08/01/2012

Draft Document - Electrical insulating materials - Determination of the effects of ionizing radiation - Part 1: Radiation interaction and dosimetry (IEC 112/203/CD:2012)

Published Date: 03/01/1996

Electrical insulating materials - Determination of the effects for ionizing radiation - Part 1: Radiation interaction and dosimetry (IEC 60544-1:1994); German version EN 60544-1:1994

Published Date: 08/01/2006

Flexible insulating sleeving - Part 2: Methods of test (IEC 60684-2:1997 + A1:2003 + A2:2005); German version EN 60684-2:1997 + A1:2003 + A2:2005

Published Date: 10/01/2010

Draft Document - Electric and optical fibre cables - Test methods for non-metallic materials - Part 203: General tests - Measurement of overall dimensions (IEC 20/1134/CDV:2010); German version FprEN 60811-203:2010

Published Date: 10/01/2010

Draft Document - Electric and optical fibre cables - Test methods for non-metallic materials - Part 409: Miscellaneous tests - Loss of mass test for thermoplastic insulations and sheaths (IEC 20/1145/CDV:2010); German version FprEN 60811-409:2010

Published Date: 04/01/2014

Electrical insulating materials - Determination of the effects of ionizing radiation - Part 1: Radiation interaction and dosimetry (IEC 60544-1:2013); German version EN 60544-1:2013

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage