DIN EN 60738-1 PDF

Published Date: 08/01/2023

Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification (IEC 60738-1:2022); German version EN IEC 60738-1:2022

Published Date: 04/01/2022

Draft Document - Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification (IEC 40/2880/CDV:2021); German and English version prEN IEC 60738-1:2021

Published Date: 04/01/2022

Draft Document - Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification (IEC 40/2880/CDV:2021); German and English version prEN IEC 60738-1:2021

Published Date: 06/01/2010

Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification (IEC 60738-1:2006 + A1:2009); German version EN 60738-1:2006 + A1:2009

Published Date: 12/01/1989

Electrical communication engineering; four pole plug

Published Date: 04/01/1971

Metallized polyethylene terephthalate film dielectric capacitors, 100 to 400 V d.c., for extended life for printed wiring

Published Date: 10/01/1999

Connectors for use in d.c. low frequency analogue and digital high speed data applications - Part 4-104: Printed board connectors with assessed quality; detail specification for two-part modular connectors, basic grid of 2.0 mm, with terminations on a multiple grid of 0.5 mm (IEC 61076-4-104:1999); German version EN 61076-4-104:1999

Published Date: 09/01/2000

Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-1: Detail specification; dimensions for cabinets (IEC 61969-2-1:2000); German version EN 61969-2-1:2000

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage