DIN EN 60749-3 PDF

Published Date: 01/01/2018

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017

Published Date: 04/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002

Published Date: 05/01/1994

Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 9: miscellaneous tests; identical with IEC 60512-9:1992

Published Date: 12/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022

Published Date: 05/01/2006

Fixed capacitors for use in electronic equipment - Part 6: Sectional specification - Fixed metallized polycarbonate film dielectric d.c. capacitors (IEC 60384-6:2005); German version EN 60384-6:2005

Published Date: 07/01/2007

Draft Document - Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/665/CDV:2007); German version prEN 61249-4-15:2007

Published Date: 09/01/1999