DIN EN 60749-9 PDF

Published Date: 11/01/2017

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017

Published Date: 04/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2002); German version EN 60749-9:2002

Published Date: 11/01/1992

Harmonized system of quality assessment for electronic components; detail specification: lead-screw actuated and rotary preset potentiometers; german version EN 141101:1992

Published Date: 09/01/1994

Base materials for printed circuits - Part 2: Specifications; specification No. 8: Flexible copper-clad polyester (PETP) film (IEC 60249-2-8:1987 + A1:1993); German version EN 60249-2-8:1994 + A1:1994

Published Date: 11/01/2006

Connectors for electronic equipment - Tests and measurements - Part 14-5: Sealing tests - Test 14e: Immersion at low air pressure (IEC 60512-14-5:2006); German version EN 60512-14-5:2006

Published Date: 05/01/2008

Draft Document - Connectors for electronic equipment - Tests and measurements - Part 19-1: Chemical resistance tests - Test 19a: Fluid resistance of pre-insulated crimp barrels (IEC 48B/1864/CD:2008)

Published Date: 09/01/1989

Published Date: 10/01/1988