DIN EN 61189-5-503 PDF

Published Date: 01/01/2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017

Published Date: 11/01/1992

Sectional specification: flexible printed boards with through connections; german version EN 123500:1992

Published Date: 09/01/1993

Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993

Published Date: 07/01/2007

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV:2007); German version prEN 61249-2-33:2007

Published Date: 07/01/2008

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007

Published Date: 01/01/1999