DIN EN 62047-9 PDF

Name:
DIN EN 62047-9 PDF

Published Date:
03/01/2012

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011

Publisher:
DIN-adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	26
Product Code(s) :	1860349, 1860349
Published :	03/01/2012

History

Related products

DIN 41636-3

Published Date: 10/01/1985

Sensitive switches for communication technology; dimensions, ratings, requirements, tests; type B

$20.274

DIN EN 61188-5-2

Published Date: 05/01/2004

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003

$44.472

DIN EN 61188-5-5 - DRAFT

Published Date: 10/01/2004

Draft Document - Printed board and printed board assemblies - Design and use - Part 5-5: Sectional requirements - Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 91/465/CDV:2004); German version prEN 61188-5-5:2004

$42.51