DIN EN IEC 60749-39 PDF

Published Date: 10/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022

Published Date: 07/01/2021

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020

Published Date: 07/01/2021

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020

Published Date: 02/01/1976

Multipole connectors with blade contacts 2.5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622

Published Date: 10/01/2022

Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard (IEC 60917-1:2019); German version EN IEC 60917-1:2019

Published Date: 10/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022

Published Date: 09/01/2009

Draft Document - Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (IEC 48D/398/CD:2009)

Published Date: 04/01/1996