Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

Publisher:
DIN EN IEC

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Number of Pages :	17
Product Code(s) :	3394325, 3394325, 3394325
Published :	12/01/2023

History

DIN EN IEC 61189-2-501

Published Date: 12/01/2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

$31.392

DIN EN IEC 61189-2-501 - DRAFT

Published Date: 12/01/2020

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (IEC 91/1634/CD:2019); Text in German and English

$31.392

DIN EN IEC 61189-2-501 - DRAFT

Published Date: 12/01/2020

$28.449

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