Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.5 W/(m·K) and defined flammability (vertical burning test), copper-clad for
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.5 W/(m·K) and defined flammability (vertical burning test), copper-clad for
Draft Document - Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E glass reinforced laminate sheets of thermal conductivity (1.5 W/m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/1448/CDV:2017); German version prEN 61249-2-46:2017