DIN EN IEC 61760-1 PDF

Published Date: 12/01/2022

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020); German version EN IEC 61760-1:2020

Published Date: 09/30/2020

Draft Document - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 91/1602/CDV:2019); German and English Version prEN IEC 61760-1:2019

Published Date: 09/30/2020

Draft Document - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 91/1602/CDV:2019); German and English Version prEN IEC 61760-1:2019

Published Date: 09/30/2006

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006

Published Date: 04/01/2010

Draft Document - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)

Published Date: 04/01/2011

Draft Document - Mechanical structures for electronic equipment-Thermal management - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 48D/453/CD:2010)

Published Date: 10/01/2012

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (IEC 60297-3-107:2012); German version EN 60297-3-107:2012

Published Date: 12/01/2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012); German version EN 61837-1:2012

Published Date: 04/01/1995