DIN EN IEC 63251 - DRAFT PDF

Published Date: 07/01/2024

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023

Published Date: 05/01/2020

Draft Document - Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress (IEC 91/1626/CD:2019); Text in German and English

Published Date: 05/01/2020

Draft Document - Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress (IEC 91/1626/CD:2019); Text in German and English

Published Date: 01/01/1998

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997

Published Date: 01/01/2004

Draft Document - Printed board and printed board assemblies - Design and use - Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 91/416/CD:2003)

Published Date: 10/01/2008

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-1:2008); German version EN 61249-4-1:2008

Published Date: 07/01/2009

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008); German version EN 61249-2-36:2009

Published Date: 2002