Published Date: 11/01/2003

Workmanship requirements for soldered electronic assemblies - Part 1: General (IEC 61192-1:2003); German version EN 61192-1:2003

$51.666

DIN EN 60749-1

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003

$17.985

DIN EN 61747-6

Published Date: 12/01/2004

Liquid crystal and solid-state display devices - Part 6: Measuring methods for liquid crystal modules - Transmissive type (IEC 61747-6:2004); German version EN 61747-6:2004

$38.913

DIN EN 61249-2-22

Published Date: 08/01/2005

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-22:2005); German version EN 61249-2-22:2005

$31.392