DIN IEC 60510-2-7 PDF

Name:
DIN IEC 60510-2-7 PDF

Published Date:
09/01/1993

Status:
Active

Description:

Methods of measurement for radio equipment used in satellite earth stations; measurements for sub-systems; high-power amplifier; identical with IEC 60510-2-7:1989

Publisher:
DIN-adopted IEC Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Number of Pages :	7
Product Code(s) :	2573695, 2573695
Published :	09/01/1993

History

Related products

DIN EN 302096

Published Date: 07/01/2000

Digital Enhanced Cordless Telecommunications (DECT) - Cordless Terminal Mobility (CTM) - Feature Package 1 (FP1); CTM circuit-switched data profile, 32 kbit/s and 64 kbit/s unrestricted digital information (UDI) (Endorsement of the English version EN 302096 V 0.2.3 (1999-11) as German standard)

$5.232

DIN ETS 300538

Published Date: 04/01/1996

European digital cellular telecommunications system (phase 2) - Technical realization of facsimile group 3, transparent; English version ETS 300538:1995

$33.681

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1