DIN IEC 60512-27-100 - DRAFT PDF

Published Date: 09/01/1994

Base materials for printed circuits - Part 2: Specifications; specification No. 8: Flexible copper-clad polyester (PETP) film (IEC 60249-2-8:1987 + A1:1993); German version EN 60249-2-8:1994 + A1:1994

Published Date: 12/01/2002

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-7:2002); German version EN 61249-2-7:2002

Published Date: 02/01/2005

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)

Published Date: 12/01/2007

Fixed capacitors for use in electronic equipment - Part 4-1: Blank detail specification - Fixed aluminium electrolytic capacitors with non-solid electrolyte - Assessment level EZ (IEC 60384-4-1:2007); German version EN 60384-4-1:2007

Published Date:

IEEE/NACE Draft Standard Practice - Atmospheric Above Grade Inspection and Assessment of Corrosion on Steel Electrical Transmission, Distribution, and Substation Structures

Published Date: 01/01/2018

IEEE/NACE Approved Draft Standard - Atmospheric Above Grade Inspection and Assessment of Corrosion on Steel Electrical Transmission, Distribution, and Substation Structures