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ECIA 216 PDF

ECIA 216 PDF

Name:
ECIA 216 PDF

Published Date:
01/01/1959

Status:
[ Active ]

Description:

Adhesion of Printed Wiring, Method of Test for

Publisher:
Electronic Components Industry Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
ecia-216_2585380
Choose Document Language:
22.50 €
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SAME AS ANSI C83.78

This Standard is intended for determining the following characteristics of printed wiring boards: (a) resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of conductors at standard room temperature before and after solder dipping, and at elevated temperatures, and (c) resistance of large conductor areas to blistering as a result of solder dipping.


Edition : 59
File Size : 0 files
Number of Pages : 9
Published : 01/01/1959

History

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