Name:
ECIA 540FA00 PDF
Published Date:
04/01/1992
Status:
[ Withdrawn ]
Publisher:
Electronic Components Industry Association
The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed ____ volts (mis).
c) Current not to exceed ____ amperes per pin.
OBJECT
The object of this Detail Specification is to provide all information required for, using Sectional Specification Eh-540F000 as a base, for the identification and quality assessment of Multi- Package Module sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
| Edition : | 92 |
| File Size : | 0 files |
| Number of Pages : | 17 |
| Published : | 04/01/1992 |
