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ECIA 540FA00 PDF

ECIA 540FA00 PDF

Name:
ECIA 540FA00 PDF

Published Date:
04/01/1992

Status:
[ Withdrawn ]

Description:

Blank Detail Specification for Multi-Package Module Sockets for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$2.1
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W/D NO S/S

The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed ____ volts (mis).

c) Current not to exceed ____ amperes per pin.

OBJECT

The object of this Detail Specification is to provide all information required for, using Sectional Specification Eh-540F000 as a base, for the identification and quality assessment of Multi- Package Module sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.


Edition : 92
File Size : 0 files
Number of Pages : 17
Published : 04/01/1992

History

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