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ECIA 540GA00 PDF

ECIA 540GA00 PDF

Name:
ECIA 540GA00 PDF

Published Date:
01/01/1993

Status:
[ Withdrawn ]

Description:

Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$2.4
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W/D NO S/S

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure (maximum length, width, and height dimensions).

b) A working voltage not exceeding _ volts (rms).

c) Current not exceeding _ ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspection purposes.


Edition : 93
File Size : 0 files
Number of Pages : 19
Published : 01/01/1993

History

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