Name:
ECIA CB 5-1 PDF
Published Date:
05/01/1971
Status:
[ Active ]
Publisher:
Electronic Components Industry Association
The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices.
| Edition : | 71 |
| File Size : | 0 files |
| Number of Pages : | 14 |
| Published : | 05/01/1971 |