ECIA EIA-364-56 PDF

PURPOSE

This test is performed for the purpose of determining whether component parts can withstand the effects of the heat to which they will be subjected during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques. The heat can be either conducted heat through the termination into the component part, or radiant heat from the solder bath when in close proximity to the body of the component part, or both. In order to establish a standard test procedure using simple and readily available equipment, the solder dip method is used as a reasonably close simulation of conditions encountered in wave soldering in regard to radiated and conducted heat. The heat of soldering can cause solder reflow which may affect the electrical characteristics of the component part and may cause damage to the materials making up the part, e .g., loosening of terminations or windings, softening or distortion of insulation materials, opening of solder seals, weaking of mechanical joints, etc.