ECIA EIA-510 PDF

This procedure provides a means for characterizing the internal structural features of multilayer ceramic capacitors. Application of methods embodied in this procedure, when required by appropriate procurement control specifications, will ensure the uniform analysis of potential reliability risks due to structural abnormalities in multilayer ceramic capacitors. The procedure is divided into three groups as follows:

Method of Sample Preparation

Paragraph 3.0 describes two levels of sample preparation, a decapsulation procedure for molded or cased capacitors, and a mounting and sectioning procedure, based on metallographic techniques for monolithic bodies.

The mounting and sectioning procedure is directly applicable to ceramic chip capacitors.

Inspection Requirements

Paragraph 4.0 covers the microscopic examination of the termination and the internal cross section of the capacitor body. Structural abnormalities are defined and illustrated.

Application Notes

Paragraph 5.0 deals with the possibilities of introducing false structural abnormalities, or altering existing ones, during sample preparation. Although sample preparation is exactly defined, substantial alterations can be readily introduced by slight, inadvertent departures from the method described.