ECIA EIA-540ABAA PDF

ECIA EIA-540ABAA PDF

Name:
ECIA EIA-540ABAA PDF

Published Date:
03/01/1991

Status:
[ Stabilized ]

Description:

Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)

Publisher:
Electronic Components Industry Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$25.5
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ANSI APPROVED

The Chip Carrier Sockets of assessed quality covered by this detail specification shall have:

a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1.

b) A working voltage not exceeding 125 volts (rms)

c) Current not exceeding 1 ampere per pin.

OBJECT

The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes.


ANSI : ANSI Approved
Edition : 91
File Size : 0 files
Number of Pages : 18
Published : 03/01/1991

History


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