Name:
ECIA EIA-540B0AA-A PDF
Published Date:
10/01/2001
Status:
[ Active ]
Publisher:
Electronic Components Industry Association
This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1089 and greater.
Purpose
The purpose of this detail specification is to provide all information required for the identification and assessment of the BGA socket described herein. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
| Edition : | A |
| File Size : | 0 files |
| Number of Pages : | 40 |
| Published : | 10/01/2001 |
