ECIA EIA-540FAAB PDF

ECIA EIA-540FAAB PDF

Name:
ECIA EIA-540FAAB PDF

Published Date:
06/10/1992

Status:
[ Stabilized ]

Description:

Detail Specification for Multi- Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$26.7
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ANSI APPROVED

The Multi-Package Module Sockets of aswssed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed 250 volts (mis).

c) Current not to exceed 1.0 ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required using Sectional Specification EA-54ûFûûû as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quaMy system. The information contained herein or by reference is complete and sufficient for inspection purposes.


Edition : 92
File Size : 0 files
Number of Pages : 22
Published : 06/10/1992

History


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