Name:
ECIA EIA-540FAAC PDF
Published Date:
06/01/1992
Status:
[ Stabilized ]
Publisher:
Electronic Components Industry Association
The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed 250 volt (rms).
c) Current not to exceed 1.0 ampere per pin.
OBJECT
The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
| Edition : | 92 |
| File Size : | 0 files |
| Number of Pages : | 24 |
| Published : | 06/01/1992 |
