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ECIA EIA-540FAAD PDF

ECIA EIA-540FAAD PDF

Name:
ECIA EIA-540FAAD PDF

Published Date:
06/01/1992

Status:
[ Stabilized ]

Description:

Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$24.3
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The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed 250 volts (rms).

c) Current not to exceed 1.0 amperes per pin.

OBJECT

The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.


Edition : 92
File Size : 0 files
Number of Pages : 24
Published : 06/01/1992

History

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