ECIA EIA-540GAAA PDF

ECIA EIA-540GAAA PDF

Name:
ECIA EIA-540GAAA PDF

Published Date:
10/01/1993

Status:
[ Stabilized ]

Description:

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$25.5
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The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.

b) A working voltage not exceeding 125 volts (rms)

c) Current not exceeding 1 ampere per pin

OBJECT

The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.


Edition : 93
File Size : 0 files
Number of Pages : 20
Published : 10/01/1993

History


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