Name:
ECIA EIA-540HAAA PDF
Published Date:
06/01/2000
Status:
[ Stabilized ]
Publisher:
Electronic Components Industry Association
The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have:
— Maximum enclosure dimensions as shown in figure 2.
— A working voltage not exceeding 250 volts (rms).
— Current rating not exceeding 1 ampere per pin.
Object
The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
| Edition : | 00 |
| File Size : | 0 files |
| Number of Pages : | 31 |
| Published : | 06/01/2000 |
