ECIA EIA-700AAAB PDF

This standard is applicable to high density, modular two-part connectors, designed for use with printed mezzanine cards that are intended to be installed parallel to host printed boards. The resultant stack height between the mezzanine card and the host boards can vary, depending upon the plug and receptacle combination selected. One or more connectors bmea iyn stalled on a mezzanine card ohr ost board. Connectors may be positioned end-to-end and/or side-to-side on the boards to make up arrays of connectors to satisfy the needs of different applications.

Object

The object of this detail specificationi s to provide all the information necessartyo implement the connectors described herein. Typical applications are showinn t he following IEEE Standards:

P1386: Standard for a Common Mezzanine Card (CMC) Family

P1386.1: Standard for PC1 Mezzanine Cards (PMC)

P1386.2: Standard for SBUS Mezzanine Cards (SMC)

All of the above are based on the IEEE P1301.4 and the other related IEEE Hard Metric Mechanical Standards. This standard also provides all the information required for the identification, qualification testing, and quality assessment of the 1.0 mm Mezzanine Connectors in accord with the EIA-NECQ Quality System. The information contained herein, or by reference, may ablso be used for inspection purposes.

This standard is intended to be used in conjunction with Generic Specification EIA-7000000, Sectional Specification, Printed Board Connectors, EIA-700A000, and EIA-364, Test Procedures, including Environmental Classifications, and Bellcore Technical Reference TR-NWT-001217.

Two Performance Levels are specified herein (PL1 and PL2) ; PL1 is intended for usein computer equipment, and uses EIA-364 guidelines.

PL2 is intended for telecommunication equipment applications, and uses the guidelines given in Bellcore TR-NWT-001217, except that the initial low level contact resistance maximum must not exceed 30 milliohms, and the test voltage for the DWV test shale be 250 V.